HSQ Negative EBL Resist

Description

When precision matters, our HSQ Negative EBL Resist stands out for its ability to deliver sub-10nm patterning with low line edge roughness and outstanding etch resistance. This resist is ideal for advanced microfabrication and semiconductor processes, offering consistent results thanks to its robust formulation. Whether you’re developing next-gen chips or intricate nanostructures, you can rely on DisChem’s HSQ Negative EBL Resist to help you achieve the accuracy and reliability your project demands.