The introduction of Ceramic PCB board

Description

Ordinary PCB is usually made of copper foil and substrate bonding, and the substrate is mostly glass fiber (FR-4), phenolic resin (FR-3) and other materials, adhesives are usually phenolic, epoxy, etc. In the process of PCB processing due to thermal stress, chemical factors, improper production technology and other reasons, or in the design process due to the two sides of the copper asymmetry, it is easy to lead to different degrees of PCB board warping.

And another PCB substrate – ceramic substrate, due to heat dissipation performance, current carrying capacity, insulation, thermal expansion coefficient, are much better than ordinary glass fiber PCB board, so it is widely used in high-power power electronic modules, aerospace, military electronics and other products.

Ceramic substrate and ordinary PCB using adhesive copper foil and substrate bonding together, Ceramic PCB is in the high temperature environment, through the bonding method of copper foil and ceramic substrate together, strong binding force, copper foil will not fall off, high reliability, stable performance in high temperature, high humidity environment.

5. Three materials of ceramic substrate

Al2O3

Al2O3 is the most commonly used substrate material in ceramic substrate because of its high strength and chemical stability compared to most other oxide ceramics in mechanical, thermal and electrical properties, and rich raw material sources, suitable for a variety of technical manufacturing and different shapes. According to the percentage of alumina (Al2O3) can be divided into: 75 porcelain, 96 porcelain, 99.5 porcelain. With different amounts of alumina, its electrical properties are almost unaffected, but its mechanical properties and thermal conductivity vary greatly. There is more glass in the substrate with low purity and the surface roughness is large. The higher the purity of the substrate, the cleaner, compact, the lower the dielectric loss, but the higher the price.

BeO

It has higher thermal conductivity than aluminum. It is applied to the occasions where high thermal conductivity is needed. It decreases rapidly after the temperature exceeds 300℃, but its toxicity limits its own development.

AlN

AlN are ceramics with aluminum nitride powder as the main crystalline phase. Compared with alumina ceramic substrate, the insulation resistance, insulation resistance and dielectric constant are higher. Its thermal conductivity is 7~10 times that of Al2O3, and its thermal expansion coefficient (CTE) is approximately matched with silicon wafer, which is very important for high-power semiconductor chips. In the production process, the thermal conductivity of AlN is greatly affected by the content of residual oxygen impurities, and the decrease of oxygen content can significantly improve the thermal conductivity. At present, it is no problem that the thermal conductivity of the production level reaches 170W/ (m·K).

For the above reasons, it can be known that alumina ceramics are in a leading position in the fields of microelectronics, power electronics, hybrid microelectronics and power modules due to their superior comprehensive performance. Compared with the same size on the market (100mm×100mm×1mm), different materials of ceramic substrate price: 96% alumina 9.5 yuan, 99% alumina 18 yuan, aluminum nitride 150 yuan, beryllium oxide 650 yuan, you can see that different substrate price gap is also relatively large.

Hitech Circuits is a professional and reliable manufacturer of Ceramic PCBs, with many years of experience in making Ceramic PCBs, which enables the manufacture of high technology, high quality and difficult performance boards, and guarantees the quality and reliability of every product delivered to customers. If you have the need to make Ceramic PCB, welcome to contact us!

https://www.hitechpcba.com/ceramic-pcb
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